• CPU
    • Intel® Atom® x5-E3930 1.3GHz/2C/6.5W
    Chipset
    • SoC integrated
    System Memory
    • 1 x DDR3L-1866 SO-DIMM, up to 8GB
    COM
    • 2 x Isolated RS-232/422/485 (Phoenix Type)
    • 4 x Isolated RS-232/422/485 (4-wire, Phoenix Type)
    USB
    • 2 x USB 3.0
    Ethernet
    • 3 x RJ-45 isolated 10/100/1000 Mbps Ethernet (Intel® i211-AT)
    • Isolation voltage: 1.5 kV
    PoE
    • N/A
    CANbus
    • N/A
    Digital I/O
    • 1 x Isolated 8-in/8-out DIO
    Analog Input
    • N/A
    Display
    • 1 x HDMI (up to 1920 x 1200 @60Hz)
    Expansion
    • 1 x M.2 Key B 3052: USB 3.0 /PCIe (for 5G module)
    • 1 x Full-size Rev.1.2 PCI Express Mini Card slot: USB (for LTE/Wi-Fi module)
    • 1 x Half-size Rev.1.2 PCI Express Mini Card slot: USB/mSATA (for mSATA)
    • 2 x SIM Slot
    Storage
    • 1 x mSATA (occupied 1 x PCI Express Mini Card slot)
    • 1 x Internal 2.5″ SATA drive (9.5 mm height)
    • 1 x eMMC on board (optional)
    Others
    • TPM 2.0
    • 3 x Antenna opening
    Power Supply
    • 1 x Terminal block, 9 to 36 VDC
    Watchdog Timer
    • 255 levels, 1 to 255 sec.
    Construction
    • Extruded aluminum and heavy-duty steel, IP30
    Operating Temperature
    • -40°C to +85°C (-40°F to +185°F)
    Relative Humidity
    • 0% to 95%
    Vibration
    • 3 Gms with storage (5 to 500Hz, X/Y/Z direction; random, operating)
    Dimensions
    (W x D x H)
    • 66 x 110 x 155 mm (2.48″ x 4.33″ x 6.1″)
    Weight (net/gross)
    • 1.0 kg (2.2 lb)/1.50 kg (3.3 lb)
    Certifications
    • CE (Class A), FCC (Class A)
    EOS Support

Fanless DIN Rail Computer

Cost-effective with fanless and cableless design

Intel® Atom® Processor E3930

6 isolated COM, isolated DIO (8-in/8-out), 3 GbE LAN

Wide operating temperature range from -40°C to +85°C

9 to 36 VDC power input with OVP, UVP, OCP, RPP

Supports 5G connectivity

Supports TPM 2.0