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CPU - Intel® Atom® x5-E3930 1.3GHz/2C/6.5W
Chipset - SoC integrated
System Memory - 1 x DDR3L-1866 SO-DIMM, up to 8GB
COM - 2 x Isolated RS-232/422/485 (Phoenix Type)
- 4 x Isolated RS-232/422/485 (4-wire, Phoenix Type)
USB - 2 x USB 3.0
Ethernet - 3 x RJ-45 isolated 10/100/1000 Mbps Ethernet (Intel® i211-AT)
- Isolation voltage: 1.5 kV
PoE - N/A
CANbus - N/A
Digital I/O - 1 x Isolated 8-in/8-out DIO
Analog Input - N/A
Display - 1 x HDMI (up to 1920 x 1200 @60Hz)
Expansion - 1 x M.2 Key B 3052: USB 3.0 /PCIe (for 5G module)
- 1 x Full-size Rev.1.2 PCI Express Mini Card slot: USB (for LTE/Wi-Fi module)
- 1 x Half-size Rev.1.2 PCI Express Mini Card slot: USB/mSATA (for mSATA)
- 2 x SIM Slot
Storage - 1 x mSATA (occupied 1 x PCI Express Mini Card slot)
- 1 x Internal 2.5″ SATA drive (9.5 mm height)
- 1 x eMMC on board (optional)
Others - TPM 2.0
- 3 x Antenna opening
Power Supply - 1 x Terminal block, 9 to 36 VDC
Watchdog Timer - 255 levels, 1 to 255 sec.
Construction - Extruded aluminum and heavy-duty steel, IP30
Operating Temperature - -40°C to +85°C (-40°F to +185°F)
Relative Humidity - 0% to 95%
Vibration - 3 Gms with storage (5 to 500Hz, X/Y/Z direction; random, operating)
Dimensions
(W x D x H)- 66 x 110 x 155 mm (2.48″ x 4.33″ x 6.1″)
Weight (net/gross) - 1.0 kg (2.2 lb)/1.50 kg (3.3 lb)
Certifications - CE (Class A), FCC (Class A)
EOS Support
Fanless DIN Rail Computer
Cost-effective with fanless and cableless design
Intel® Atom® Processor E3930
6 isolated COM, isolated DIO (8-in/8-out), 3 GbE LAN
Wide operating temperature range from -40°C to +85°C
9 to 36 VDC power input with OVP, UVP, OCP, RPP
Supports 5G connectivity
Supports TPM 2.0